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B-BOX adopts autonomous syscfg algorithm
Small size 36
solves the problem of repairing and fixing laptop motherboards
and white background when saving front and rear camera photos and videos caused by non-original front cameras
so it need be sold as a set
HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 B-BOX adopts autonomous syscfg algorithmHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.
